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Wire Wound Chip Ferrite Bead
Overview

The wire wound chip ferrite bead has small DC Resistance and larger rated current. It is useful for EMI suppression within frequency range of 1MHZ ~ 100MHZ applied to electronics power supply lines or large current signal lines.

Background

With the requirement of low power consumption, the EMI filter with large current and low frequency suppression capability is demanded. The wire wound ferrite bead is the exactly right product. The application includes power lines or signal lines, such as computers and peripherals, DVD, camera, LCD TV screen and other audio equipment, communications,OA equipments, etc.

Features
  • Winding structure with large rated current
  • Magnetic shielded structure suitable for 1MHz~100MHz EMI suppression
  • Bottom electrode suitable for SMT
Applications

Noise suppression for power line or large current signal line of electric equipments such as computers and peripheral devices, DVD, cameras, LCD TVS, communication equipments, OA equipments, etc.

Dimensions

Part Number

Electrical Characteristics

 

SPH3015HZ TYPE

Part
Number
Impedance
DC Resistance
Heat Rating Current
Marking
1MHz,1V
Max.
Typ.
1 Ambient
temperature
85
2 Ambient
temperature
105
Units
Ω
Ω
Ω
mA
mA
Symbol
Z
DCR
Irms
-
SPH3015HZ3R3NT
3.3±30%
0.019
0.016
2900
1500
N/A
SPH3015HZ6R8NT
6.8±30%
0.040
0.033
2500
1380
N/A
SPH3015HZ8R4NT
8.4±30%
0.048
0040
2400
1360
N/A
SPH3015HZ9R8NT
9.8±30%
0.048
0.040
2100
1110
N/A
SPH3015HZ120NT
12±30%
0.060
0.050
1850
910
N/A
SPH3015HZ190NT
19±30%
0.084
0.070
1800
900
N/A
SPH3015HZ210NT
21±30%
0.115
0.096
1550
800
N/A
SPH3015HZ310NT
31±30%
0.115
0.096
1200
610
N/A
SPH3015HZ520NT
52±30%
0.276
0.230
1100
550
N/A
SPH3015HZ650NT
65±30%
0.276
0.230
900
450
N/A
SPH3015HZ101NT
100±30%
0.468
0.390
900
330
N/A
SPH3015HZ151NT
150±30%
0.768
0.640
490
300
N/A

Note:1: When applied rated current to the Products, temperature rise caused by self heating will be 40°C or less.
2: When applied rated current to the Products, temperature rise caused by self heating will be 20°C or less.
The part temperature (ambient + temp. rise) should not exceed 125 °C under worst case operating conditions. Circuit design, component placement, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.