List of Analysis and Test Services

No.	Equipment	Key Parameter	Application
1	SEM/EDS	Resolution (SEM):3.0nm @ 30KV,8.0nm @ 3KV. Magnification (SEM):6x~1,000,000x.Resolution (EDS):133eV @ MnKa. Element Analysis Limit :B5-U92	Microcosmic Surface Analysis, Element Analysis, Micro-area Dimension Measurement
2	Specific Surface Area Analyzer	Pore Size Distribution Range:3.5~4000Ǻ. Resolution: 0.0015%. Specific Surface Test Range:> 0.01m2/g	Specific Surface Area Analysis, Adsorption / desorption isotherms, BJH Pore Volume Distribution/Pore Radius, Pore Pattern Analysis
3	Energy dispersive X ray fluorescence analyzer	Element Analysis Limit :：Al13 ~ U92，LOD：several ppm；Analysis time：about ten minutes	RoHS and EN71 test
4	X-ray Diffracmeter	X-ray Characteristic:CoKɑ. Angular Accuracy:0.002°.Testing Method:Rotating crystal method	Crystalline Structure, Crystallinity and Grain Density Analysis, Phase Constitution Analysis
5	Rheometer	Angular Resolution:15urad; Test Range: 8 cP～124.5M cP;Temperature Range:-20~250℃.	Fluid Type Identification,Viscosity, Yield Point and Torque test Pseudoplastic, Thixotropy and Creep Deformation Test
6	Thermal Expansion Coefficient Tester	Sensitivity: 8nm/digit. Accuracy: ± 1%. Temperature Accuracy: ±1℃.Measuring Range: ±5mm.	Linear Expansion and Shrinkage Test,Grass Transition Temperature and Soften Point Test,Phase Transition and Reaction Kinetics Research
7	Simultaneous Thermal Analyzer	Temperature Range:RT～1500℃,Heating Rate:0～±99.9℃/min OR ℃/hour ,Testing Range:DTA：±1～±1000μV ；TG：±500mg,Testing Accuracy:Temperature：±1.0℃ ；Mass：±1.0 %	Thermal stability and Melting Point Test, Adsorption/desorption and Oxidation-reduction Process Analysis, Free and Crystal Water  Quantitative Analysis

No.	Equipment	Key Parameter	Application
1	X-ray Test system	Features Resolution :＜1μm. Maximum Sample Size: L*W*T：210* 100* 100mm	X-Ray TEST and Analysis
2	Tegramin System	Swivel Rate：50～150 rpm，Adjustable；Orientation：clockwise、anticlockwise. Turntable rate： 40～600rpm；Orientation: anticlockwise. Polishing： 54 dBA，Grinding： 56 dBA	Grindding and Polishing
3	SEM/EDS	Resolution (SEM):3.0nm @ 30KV,8.0nm @ 3KV. Magnification (SEM):6x~1,000,000x.Resolution (EDS):133eV @ MnKa. Element Analysis Limit :B5-U92	Microcosmic Surface Analysis, Element Analysis, Micro-area Dimension Measurement
4	Moisture Meter	Testing Method: Capacity Titrimetry; Testing Range: 10µg~100mg; Accuracy: Dissociation energy :0.1µg, RSD<0.3%.	Moisture Analysis

No.	Equipment	Key Parameter	Application
1	RF Impedance Analyzer	Frequency range :1MHz~3GHz;Impedance test range:200mΩ~20KΩ;Basic Accuracy :±0.8%.	|Z|、θz、|Y|、θy、R、X、G、B、CS、CP、LS、LP、RP、RS、D、Q、|Γ|、θr、ΓX、ΓY
2	High Impedance Analyzer	Test voltage range:0.1~1000Vdc;Dc resistance test range :1KΩ ~ 1016PΩ;Basic Accuracy :±0.6%.	Insulation resistance
3	Resistance Meter	Basic Accuracy :0.006%; Minimum resolution :0.01μΩ.	Dc resistance
4	Network Analyzer	Frequency range :9KHz~8.5GHz;Measure port:4 ports	S-parameter
5	Signal Analyzer	Frequency range :10Hz~8.4GHz;Analysis bandwidth ：40MHz	Noise factor 、Gain
6	Capacitance Meter	Frequency range :1KHz,1MHz;Test signal level :0.1~1Vrms	C、 D、Q、G、Rs、Rp
7	Varistor Tester	Voltage test range :0~1400V; Current test range :0μA~2000μA; Basic precision:±0.5%	Varistor Voltage(UN)、Nonlinear index (α) 、Leakage current Test (IL)
8	Thermostatic Oil Bath	Temperature range:-40~+100℃; Working medium :Transformer oil	The resistance value under different temperature
9	B-H Analyzer	Frequency range :10Hz～10MHz(When matching power amplifier frequency range :DC-3MHz); Rated voltage:+/-140V (Max.) ; Rated current :+/-5A (Max.); Temperature range:-30℃～150℃	B - H Analysis 、Power Consumption Analysis 、Magnetic permeability Etc.

No.	Equipment	Key Parameter	Application
1	Air to Air Thermal Shock Chamber	emperature range :+50℃~+220℃; -80℃~+70℃;Accuracy： 0.1℃.	Thermal Shock Test-Air to Air
2	High and Low Temperature Test Chamber	Temperature range :-70℃～+150℃;Accuracy: 0.1℃.	Low Temperature Storage Test
3	Fast Response Temperature Test Chamber	Temperature range ：-70℃+180℃；20℃/min；10%~98%RH；Accuracy：1℃ ,≤75%RH,≤±5%RH；＞75%RH,≤±3%RH.	Temperature Cycling、Temperature Characteristics Test
4	High Temperature Test Chamber	Temperature range ：+20℃～+200℃。	High Temperature Storage Test
5	Bench-Topn Type Temperature(& Humudity) Chamber	Temperature range ：-20℃～150℃；Humidity range (25～98)%RH；Accuracy：0.1℃，0.1%RH.	Damp Heat Test、Loading under Damp Heat、Moisture Resistance、Biased Humidity
6	Neutral Salt Spray testChamber	Spray amount:1~2mL/h/80cm2; Spray way：Programmable spray(Including continuous and intermittent spray spray).	Neutral Salt Spray test (NSS)
7	Steam aging test chamber	Temperature range :100℃-134℃;Humidity range ：100%RH; Time range:0-255hours.	Steam aging test 、PCT test
8	Reflow	Temperature range :Room~+400℃; Heating area number:六温区;PCB maximum width:350mm.	Reflow
9	Solder Pot	Temperature range :Room~+496℃;depth:38mm.	Dip and Look
10	ESD Immunity Test System	HBM model;0-15KV.	ESD test：Air discharge、contact discharge
11	Surge Immunity Test System	Waveform:8/20μs,10/1000μs;Voltage range:0~2.5KV；Current range :8/20μs:1~1500A,10/1000μs：1~90A.	Surge Current，Surge Energy
12	Mechanical vibration test System	Frequency range :5~100Hz;Amplitude:3mm-pp;Maximum Load :0~80Kg.	Low Frequency Vibration Test
13	Electric vibration test system	Frequency range :5~3000Hz; Amplitude：25mm-pp；Maximum Load ：200Kg。	High Frequency Vibration Test
14	High Acceleration Mechanical Shock Test-Bed	Waveform:Half Sine ,Sawtooth; Maximum Acceleration:Half Sine :15～600g, Sawtooth:15-100g; Normal Duration:18～1ms(Half Sine ),11-3ms (Sawtooth); Maximum Load ：20Kg。	Mechanical Shock Test
15	Single wing drop tester	Drop height range :300~1500mm;Maximum Load:80Kg; Impact panel material:Iron plate; Drop Angle range:At any Angle; Drop way:Free Drop.	Dropping Test
16	Electronic Universal Test Machine	Max. Testing Strength：10KN；Accuracy Class 0.5 level。	Terminal Strength、Resistance to Flexure、Body Strength Test Etc.

No.	Equipment	Key Parameter	Application
1	3D Printer	Tray Size(X×Y×Z)：252mm x 252mm x 200mm；Print Mode: high quality:16μm high speed:30μm Input drawing format: STL	model printing.etc