HSDPA

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GSM Mode RF
  • Multilayer Chip Ceramic Inductor/SDCL Series
  • Wire Wound Chip Ceramic Inductor/SDWL-C Series
  • Multilayer Chip High Q Inductor/HQ Series
  • Chip NTC Thermistor/SDNT Series
TD-SDCMA RF
  • Multilayer Chip Ceramic Inductor/SDCL Series
  • Wire Wound Chip Ceramic Inductor/SDWL-C Series
  • Multilayer Chip High Q Inductor/HQ Series
  • Chip NTC Thermistor/SDNT Series
PMU
  • Multilayer Chip Ferrite Inductor/SDFL Series
  • Multilayer Chip Ferrite Bead/GZ&PZ&UPZ&HPZ Series
  • Wire Wound SMD Power Inductor/SWPA&SPH Series
  • Multilayer Chip Power Inductor/MPH Series
  • Solid Tantalum&Niobium Chip Capacitors/TC2&TC3&NC Series
TD-SCDMA/ GSM Baseband
  • Multilayer Chip Ferrite Inductor/SDFL Series
  • Wire Wound Chip Ferrite Inductor/SDWL-FW Series
  • Multilayer Chip Ferrite Bead/GZ&SZ&PZ&UPZ &HZ&HPZ Series
SRAM
  • Multilayer Chip Ferrite Bead/GZ&SZ&PZ&UPZ&EPZ Series
  • Solid Tantalum&Niobium Chip Capacitors/TC2&TC3&NC Series
FLASH
  • Multilayer Chip Ferrite Bead/GZ&SZ&PZ&UPZ&EPZ Series
  • Solid Tantalum&Niobium Chip Capacitors/TC2&TC3&NC Series
EEPROM
  • Multilayer Chip Ferrite Bead/GZ&SZ&PZ&UPZ&EPZ Series
  • Solid Tantalum&Niobium Chip Capacitors/TC2&TC3&NC Series
USB I/F
  • Wire Wound Chip Common Mode Choke Coil/SDCW Series
  • Multilayer Chip Varistor/SDV Series
  • Multilayer Chip Ferrite Bead/PZ&UPZ Series
Audio
  • Multilayer Chip Varistor/SDV Series
  • Multilayer Chip Ferrite Bead/PZ&UPZ Series
  • Solid Tantalum&Niobium Chip Capacitors/TC2&TC3&NC Series
PCMCIA
  • Multilayer Chip Varistor/SDV Series
  • Multilayer Chip Ferrite Bead/PZ&UPZ Series
  • Solid Tantalum&Niobium Chip Capacitors/TC2&TC3&NC Series
Application Guides
HSDPA.pdf